Rockford Fosgate Punch PBR500X1

To achieve higher efficiency with lower distortion, Rockford's BR topology combines, Cycle-by-Cycle, an indirectly coupled high/low voltage rail linear topology with a switched high/low voltage linear rail topology. This combination yields an unsurpassed power density (watts per cubic inch). In addition, this patented technology allows the chassis design to be much smaller than traditional sized amplifier - 1.53" x 4.25" x 8.2" - making this amp a great solution for smaller stealth installations, motorcycles and recreational vehicles. In fact, now, with the introduction of the Rockford Fosgate RFKHD9813, installing the PBR500X1 into select 1998 - 2013 Harley Davidson motorcycles has never been easier. With unparalleled technology, flexible installation options, and big power from such a small footprint Rockford Fosgate has ensured that everyone can put a little Punch in any system.

Punch EQ2 - Jim Fosgate's Brainchild

The Punch EQ on-board equalization circuit helps correct the acoustical deficiencies often found in car audio systems. These deficiencies were researched and graphed out by none other than Jim Fosgate himself. From that forward thinking approach, we now have the Punch EQ2. When accompanied by the Optional Remote Punch EQ, the user has full control of a variable bass boost centered at 45 Hz.

MEHSA³ - Max Efficiency Heat Sink Application

MEHSA3 is a proprietary process that yields up to five times better heat transfer than traditional FET mounting techniques, using the exact same components. A multi-layer insulated metal substrate operating with minimal thermal resistance spreads heat both downward & outward to quickly dissipate heat from each device across the heatsink. This process allows Rockford Fosgate to squeeze more watts per cubic inch from every output device as well as provide consistent thermal stability. The higher power handling results in a 20% reduction in thermal impedance.

DSM - Discrete Surface Mounted Components

An industry-leading manufacturing process, DSM utilizes high-speed robotics, high-quality 1% tight-tolerance parts and large board traces. The discrete components are laser etched to meet a particular value and a very low tolerance. This lower tolerance improves the efficiency of the circuit, decreases cross-talk from other discrete components and lowers operating temperature. These superior components are used by aerospace, automotive, and cellular manufacturers.